ZEISS Crossbeam 550 FIB-SEM

The ZEISS 550 Crossbeam is a highly versatile instrument for material sciences (natural and synthetic, organic and inorganic), advanced materials, electronics, manifacturing and life sciences.
Combining imaging and analytical performance of a high-resolution field emission gun scanning electron microscope (FEG-SEM) with the processing capability of a focused ion beam (FIB) and a gas injection system, our ZEISS 550 Crossbeam enables:

>  High-resolution imaging 

>  Microanalyses (energy dispersive system, EDS) 

>  SEM–based quantitative microstructural-crystallographic analyses (electron backscattered diffraction, EBSD) 

>  Multichannel large area mapping 

>  Multichannel 3D tomography (imaging, EDS, EBSD) 

>  Sample preparation for TEM, APT, AFM (e.g., electron transparent films, chips, pillars) 

>  Nanofabrication through gas-assisted deposition and etching 

The Atlas software allows refinding between different imaging modalities, enabling correlative imaging of specimens.

Technical Characteristics

The ZEISS 550 Crossbeam consists of a Gemini II SEM Column and Capella FIB Column with a gallium ion source (Ga-liquid metal ion, Ga-LMIS). Special features:
> Resolution: 0.8 nm @15kV (SEM mode); 1.6 nm at 1 kV (SEM mode); 3 nm at 30kV (FOB); 120 nm @1kV (FIB);
> Magnification: 12x – 2,000,000x (SEM); 300x – 500,000x (FIB)
> Acceleration Voltage: 0.02 – 30 kV (SEM); 0.5 – 30 kV (FIB)
> Probe Current: 10 pA to 283 nA (SEM); 1 pA to 100 nA (FIB)

Equipment

Advanced imaging system with the following built-in detectors:
> In chamber SE (secondary electron) Everhart-Thornley (ET) detector.
> Six sector BSD (backscattered electron detector). Retractable.
> InLens SE detector within column.
> InLens EsB (energy-selective backscattered electron) detector within column.

Analytical detectors:

> Bruker’s QUANTAX EBSD/EDS analysis system for phase identification and textural mapping.
> Bruker’s QUANTAX 400 EDS analysis system with XFlash®6| 100 detector (resolution < 129 eV at Mn K; input count rate > 1,500 kcps; element detection from Be to Am.

Gas Injection System:

> Platinum
> Carbon
> Water (enhanced milling)
> Nitrogen (local charge compensation)

Kleindiek MM3A-EM Micromanipulator:

> In-situ TEM lamella lift-out
> Nano-manipulation

Flood gun

> Charging compensation for ion beam milling and imaging)